ABOUT ICTA 2026
The 9th IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA 2026), will be held on October 21-23, 2026, in Singapore. This conference provides an international forum according to IEEE standard for the presentation and exchange of the latest technical achievements and cross-discipline fertilisation of IC designs, technologies, and applications in our fast-changing society. This year’s theme is “Advancing IC with AI”. ICTA 2026 welcomes papers of new and innovative discoveries and designs.
The conference will feature:
- Keynote and plenary talks
- Invited talks and special sessions
- Technical paper presentations and poster sessions
- Exhibitions by leading companies
- Opportunities for collaboration and knowledge exchange
Topics include, but are not limited to, the following technical areas:
- RF Circuits and Wireless Systems: Si-based RFIC building-block circuit, compound-semiconductor-based MMIC building-block circuit, LNA, PA, VCO, PLL, phase shifter, mixer, RF switch, balun, driver amplifier, transceiver, etc.
- Analog and Mixed-Signal ICs: analog circuits including amplifiers, comparators, oscillators, filters, references, nonlinear analog circuits and digitally-assisted analog circuits; data converters including Nyquist-rate and oversampling ADC and DAC, etc.
- Power Management ICs: Power management and control circuits; switched-mode power converter ICs using inductive, capacitive, and hybrid techniques; linear regulators; gate drivers; topologies for wide-bandgap devices; power and signal isolators; LED drivers, wireless power, and envelope supply modulators; energy harvesting circuits and systems.
- Digital ICs and Memory: SoC, processor, FPGA, AI and deep-learning processor, DSP, NoC, memory, etc.
- Wireline ICs: high-speed data link, optical transceiver, OEIC, SerDes, TIA, CDRs, equaliser, modulator, etc.
- MEMS and Sensor ICs: MEMS sensors, image sensors, physical sensors, chemical sensors, bio-sensors, smart and intelligent sensors, sensor interface, sensor technology and applications, etc.
- EDA, Modeling and Testing: compact models and extraction techniques (silicon based), SPICE models and extraction techniques (non-silicon), modeling technique of GaN, SiC, ASM-HEMT, 2D-material-based devices, quantum devices, test structures design and model parameter extraction, RF calibration and reliable data acquisition, EDA, EM/TCAD simulation, co-simulation and verification technique, PDK validation, etc.
- Device and Process Technologies: CMOS, FinFET, FD-SOI, BCD, SiGe, III-V, HEMT, HBT, 3rd generation materials, GaN, power electronics, SiC, GaO, junctionless device, negative capacitance device, MEMS, device characterisation, device FAR, 3D integration, Chiplet, flash, OPT, MPT, SRAM, DRAM, 3D NAND, MRAM, RRAM, PCRAM, FeRAM, crossbar, DRAM+MCU, etc.
- Packaging and Hybrid Integration: Chiplet, active antenna, EM field, filters, Hybrid MIC, MCM, SiP, SoP, TSV, flip chip assembly, wire bonding, anisotropic conductive film, interconnection technologies, multi-physics and multi-scale EM computation/simulation, 3D integration, etc.
- Emerging Technologies and Applications: heterogeneous integration, III-V compounds, silicon photonics, optoelectronic device, 2D materials, green and implantable materials, neuromorphic device, device characterisation, etc.
- Intelligent Robots: robot kinematics/dynamics/control, system integration, AI in robotics, sensor/actuator, bio-inspired systems, robot perception, human robot interaction, and robot vision, etc.
- ICs for AI and AI for ICs: Advanced ICs for machine learning (ML), deep learning, active learning, big and small data,natural language processing, small language models, data analytics, AI security and privacy, AI for ICs, tools and design methodologies for edge AI and TinyML, etc.
The conference will feature plenaries, keynotes, invited and contributed papers. Distinguished researchers will be invited to deliver plenary and keynote speeches on technology or circuit trends and significant advances. The best contributed papers will be selected for Best Paper Awards. All papers will be presented in parallel sessions, including invited talks and focused sessions. Exhibition showcasing the latest engineering samples, tools and technology options will be facilitated as well. More information can be found at https://ieee-icta.org/.
ABOUT SINGAPORE
Singapore became an independent nation in 1965 and has since transformed into a global hub for finance and commerce. It is a prosperous, multicultural city-state in Southeast Asia known for its thriving economy, world-class infrastructure, and vibrant culture shaped by Chinese, Malay, Indian, and Eurasian communities. As a highly developed country, it has the highest PPP-adjusted GDP per capita in the world. It has a fast-growing economy with one of the world’s busiest ports, first-class education, best airport in the world, and thriving manufacturing.
Singapore invests heavily in research and development and prioritizes building a digitally capable workforce to maintain its economic competitiveness. The “Garden City” also boasts a rich cultural tapestry evident in its diverse and assessable food scene, languages, and traditions, offering a high quality of life with strong governance and a focus on research, innovation and enterprise.
More on Singapore: https://en.wikipedia.org/wiki/Singapore