The 8th IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA 2025), will be held on October 22-24, 2025 in Macao, China. This year's theme is "Analog, AI and Applications".
Special Issue of JOS: Authors are invited to submit an extend version of 5+ pages to the special issue of Journal of Semiconductor (JOS), thus possibly extending the conference abstract into a journal paper which will also appear in IEEE Xplore. The extended paper should reflect reviewers’ opinions and audience feedbacks from ICTA.
July 28, 2025
Manuscript submission deadline
September 5, 2025
Notification of acceptance
September 19, 2025
Final submission
October 22-24 2025
ICTA Conference
Macao, China
Venue | Registration
China is becoming a semiconductor hub for academia, industry and market. However, young Chinese researchers, in particular students, lack the opportunity to attend IEEE conferences. International counterparts also wish to experience firsthand the fast-growing semiconductor sector in China. To this end, ICTA was founded by a group of Chinese scholars and will be held annually in China. It will be a broad yet advanced forum for IC designs, technologies and applications worldwide.
The conference will feature both invited and contributed papers. Distinguished researchers will be invited to deliver keynote speeches on technology or circuit trends and significant advances. The best contributed papers will be selected for awards. All papers will be presented in parallel sessions, including invited talks and focused sessions. ICTA will start with FREE Distinguished Lectures and concluded with forums/workshops. Exhibition showcasing the latest engineering samples, tools and technology options will be facilitated as well.
Both invited and contributed papers that are accepted by ICTA will be published in conference proceeding.
◻︎RF Circuits and Wireless Systems
◼︎Analog and Mixed-Signal ICs
◻︎Power Management ICs
◼︎Digital ICs and Memory
◻︎Wireline ICs
◼︎Sensor ICs
◻︎Modeling, EDA and Testing
◼︎Device and Process Technologies
◻︎Packaging and Hybrid Integration
◼︎Emerging Semiconductor Materials and Devices
◻︎System and Applications
◼︎Intelligent Robots